Chipmaking systems create the smallest atomic-scale features in 3D Gate-All-Around transistorsPrecision™ Selective Nitride PECVD preserves ...

Applied Materials introduced semiconductor manufacturing gear designed to create the world's most advanced logic chips. AMAT ...

A convergence of DFT techniques and the proliferation of in-silicon monitors can flag potential failures before they occur.

Wall Street is turning its attention to chip equipment makers as spending on new ...

Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...

To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing systems.

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

In today’s rapidly evolving semiconductor landscape, System-on-Chips (SoCs) are becoming increasingly complex, integrating multiple processing cores, specialized accelerators and vast memory arrays.

The 100 million-square-foot facility will make two kinds of chips for terrestrial and space applications. The Terafab project is reportedly valued at up to $25 billion.

King Yuan Electronics Co. (KYEC) held its year-end banquet, where chairman C.K. Lee said that collaboration with employees, customers, and suppliers has positioned the company as a major chip testing ...

Intel partners with Tesla TeraFab to scale 18A chip production in the US, targeting massive compute output and faster ...