Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

TL;DR: Apple and Bitmain will lead demand for TSMC's cutting-edge 2nm process node in 2026, with TSMC ramping capacity to 60,000 wafers monthly by Q4. NVIDIA will adopt TSMC's 3nm node for Rubin AI ...

Apple makes well-received products, but something that sets it apart from other brands is its attention to detail. From tight corner radius rules and iconography to the familiar look of Apple Store ...

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a 2nm process for the A20-series chip used in the iPhone 18, Apple is set to ...

Apple has begun mass production of its next-generation M5 series chips for key products such as the next-generation Mac and iPad, according to the Korean media outlet ETNEWS. The M5 lineup includes ...