Business Wire

Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform

Companies advance multi-die planning and implementation, leveraging Cadence’s Integrity 3D-IC platform, the industry’s only unified platform that combines system planning, packaging and system-level ...
Nasdaq

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems The Tempus Timing ...
Yahoo Finance

Cadence Introduces Voltus IC Power Integrity Solution, Delivering Exceptional Performance and Capacity in Power Signoff

Tightly integrated with key Cadence tools throughout the design flow, including Cadence Tempus Timing Signoff Solution, for the fastest design closure in the industry "As a global leader in embedded ...
Design-Reuse

Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dbloxâ„¢ Standard

SAN JOSE, Calif.— April 26, 2023-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced new design flows based on the Cadence ® Integrity ™ 3D-IC platform to support the TSMC 3Dblox ™ standard ...
Seeking Alpha

Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry

Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P process node SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) ...