BOISE, Idaho, Nov. 09, 2020 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced that it has begun volume shipments of the world’s first 176-layer 3D NAND flash memory, achieving ...
Next-generation automotive systems are advancing beyond the limits of currently available technologies. The addition of advanced driver assistance systems (ADAS) and other advanced features requires ...
At Pure Storage’s Accelerate Conference Toshiba presented a flash roadmap and talked about increasing their 3D NAND stack up to 192 layers in the future. All the major flash manufacturers have ...
Memory manufacturer SK Hynix has become the first company in the world to surpass 300 layers of NAND flash, marking an important milestone in developing high-density flash storage. The company ...
Cypress Semiconductor Corp. announced general availability of its USB host mass storage reference design kit (RDK) for embedded applications. The CY4640 hardware/software solution enables mass storage ...
Editor’s Note: NAND and NOR Flash memory play an integral role in embedded systems of all sorts but successful implementation requires careful attention to key ...
SAN JOSE, California — At the Open Compute Project (OCP) Summit today, Kushagra Vaid, general manager for Microsoft’s Azure hardware infrastructure, announced Project Denali. Its purpose is to create ...
The evolution in consumer electronics’ applications has resulted in an enlargement of the digital data amount. The expansion of digital information in consumer electronics has stimulated the ...
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