TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...
Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of its Integrated ...
Chips are getting bigger in a bid to offer more functionality, and conversely, packages are required to house these bigger die sizes in even more compact form factors. That inevitably mandates new ...
The use of FinFET devices in next-generation high-performance, low-power designs is a fundamental shift that is happening in the semiconductor industry. These devices through their smaller sizes, ...
SANTA CLARA, Calif., Sept. 5, 2017 /PRNewswire/ -- AnaGlobe Technology, Inc., a leader in layout integration solutions, will announce a unified chip-package layout solution, with features and extended ...
Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Originally, I started to write this entry about a Sustainable Brand Identity. But as I put pen to paper and fingers to keyboard, I realized that my opening paragraph deserved a bit more attention.
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