Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...

Olympus Integrated Technologies America presented its 3D-ICautomated metrology system at SEMICON West 2010. The system provides preciseimaging to verify the alignment of bonded wafers and TSVs ...

One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., ...

A technique which will allow silicon wafers to be stacked accurately and inexpensively in 3-D structures has been developed by researchers at the University of Southampton. According to Dr Michael ...

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. (Nanowerk News) PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing ...

PI’s latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. PI’s F-713 6-axis ...

Carbon nanotubes can be five times as energy efficient and five times faster than silicon. engineers at the University of Wisconsin–Madison can align the nanotubes for computer chips by turning them ...

Semiconductor manufacturing depends heavily on the ability of machine-vision systems to correctly locate, identify, and align wafers and circuits for testing. Inaccuracy in any of these activities can ...

LAKE SUCCESS, N.Y.--(BUSINESS WIRE)--Canon U.S.A., Inc., a leader in digital imaging solutions, recently announced that it has commenced sales of the new FPA-6300ES6a Deep Ultra-Violet (DUV) scanner, ...

The solar industry must work together to agree on standardised larger wafer sizes, according to monocrystalline solar manufacturer LONGi Group. The company has revealed that its H-MO4 module, which ...

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. Parallel miniaturized piezoelectric alignment engines with fly-height sensors enable faster PIC wafer testing. Image ...

SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device ...