Abstract: Three-dimensional integrated circuits (3-D ICs) enable a higher level of device integration for high-performance computing but also introduce significant thermal challenges due to increased ...
Abstract: The pursuit of higher temperatures, frequencies, and power densities in power converters has significantly elevated the performance demands on power modules. Existing designs struggle to ...
Empower has launched three embedded silicon capacitors (ECAPs) for AI and high-performance computing (HPC) processors. The portfolio includes the EC2005P (9.34 μF in a 2×2-mm package), EC2025P (18.68 ...
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